• Composition analysis
• CD measurement
• Layer thickness
• Layer ordering
• Interfacial analysis
• Layer topography
• Step coverage
• Liftoff structure analysis
• Overmill/etch measurements
• Geometry measurement
• Grain orientation and distribution
• Surface roughness
  

• Microstructure / defect characterization
• Morphology and crystallinity
• Phase identification
• Grain orientation and size distribution
• High-resolution images on subnanometer scale
• Compositional analysis down to submicron areas
• Domain patterns
  

• Cross-sectional images from any plane of solid samples
• Layer identification
• Geometry measurements
• Materials composition
• Materials crystallinity and morphology
• Layer removal
  

• Cross-sectional images
• Void and delamination identification
• Interlayer residues
• Interconnect analysis
• Geometry characterization
• Isolation failure identification
• Concentration gradients
• Impurity characterization
• Layer thickness
• Domain patterns
  

Participation and Analysis

As needed, the engineer can be present during analysis to help identify areas of concern or respond to information as it is found and tailor the investigation while it proceeds.

Flexible Handling/Storage

Whether by email, fax, floppy, or hard copy (paper or transparency), we submit our report based on your requirement.

We will also turn over all data upon completion of analysis, or store it for your future reference.

Confidentiality

Your identity, samples and data will be held in utmost confidence. They will not be shown or released for any purpose without prior written permission which clearly states the limitations of such usage.